BY TC News Desk
Agartala, 6th February 2025: Tripura is set to host the Business Conclave-2025 on February 7 and 8 at Hotel Polo Tower in Agartala, with the participation of over 100 industrialists from across the country. The event will be held under the theme “Destination Tripura – Land of Opportunities.”
Industries and Commerce Minister Santbana Chakma announced that Chief Minister Prof. (Dr.) Manik Saha would be attending the conclave on February 8. Addressing a press conference, the Minister highlighted that the conclave aims to showcase Tripura as a key investment hub in North-East India.
“The two-day conclave will focus on critical sectors including information technology, healthcare, education, tourism, and skill development. It is designed to promote investment opportunities, boost local industries, generate employment, and highlight the state’s natural resources and industry-friendly policies,” she stated.
She further emphasized that the conclave would provide a strategic platform for investors to engage with policymakers, thereby fostering industrial growth and self-reliance among the youth.
During the press conference, Minister Chakma also announced the official launch of ‘Skill-Uday Tangnai’ on February 7. Chief Minister Prof. (Dr.) Manik Saha will inaugurate the initiative at the Tripura Institute of Technology, Narsinghgarh.
“The name ‘Skill-Uday Tangnai’ is derived from a blend of English, Bengali, and Kokborok languages and aims to train 80,000 students at the school and college levels across Tripura. Under the career guidance initiative, 75,000 students from 983 schools will receive support through the Samagra Shiksha Scheme to help them make informed career choices and overcome challenges in their respective fields,” she added.
Additionally, the Skill Tripura MIS Portal will serve as a centralized database for skill development programs. The initiative also focuses on self-reliance by providing training opportunities under the Chief Minister’s Skill Development Scheme for eligible beneficiaries.
